Abstract: AlN ceramic is a highperformance electronic packaging material, but it is difficult to joint with metals directly. AlN ceramic and Mo-Ni-Cu alloy was brazed using 98（Ag28Cu）2Ti active filler alloy in vacuum. EBSD, EDS and XRD were used to study the microstructure and phases of bonding area and the surface of the sheared sample. The mechanical properties and hermeticity performance were measured. It is found that TiN exists in the interface of AlN ceramic, which indicate that there is a chemical bond between ceramic and filler metal, but there is a few of Ni-Ti intermetallics in the interface of MoNi-Cu alloy. TiN and AlN are found on the sheared fracture surface, which indicate that fracture occurrs from the bonding area near the AlN ceramic. The sample has good performance with gas leakage rate of 1.0×10^-11Pa·m³/s, average bending strength of σ_ｂ=78.55MPa and shear strength of σ_τ=189.58MPa.

Key words: Ti-Ag-Cu active filler alloy, active brazing, microstructure analysis, mechanical properties