Effect of Plating Solution Flow Pattern on Preparation of Electroless Copper- Plated Carbon Foam under Vacuum and Ultrasonic Conditions

doi:10.15541/jim20150276

Abstract

Abstract:

Electroless plating with assistance of vacuum and ultrasonic is an effective method to coat copper onto the inner surface of bulk carbon foam. However, it is difficult to obtain uniform copper coating. In present work, the copper coating’s uniformity was improved by forcing plating solution inside the carbon foam on basis of vacuum and ultrasonic assistance during eletroless plating process. And effect of the flow pattern on plated copper’s properties was investigated. Compared with one-direction flow of plating solution, a bidirectional flow made the weight gain rate of single cut piece >7.10% and the total weight increased up to 7.68%. The copper coating at thickness >5 µm; with better uniformity was compact, smooth and no CuO or Cu₂O. The mechanical and electrical properties of Cu/carbon foam were evenly enhanced. The compression strength was increased from 0.70 MPa to 1.54 MPa, and the conductivity from 700 S/cm to 1724 S/cm.

Key words: plating solution flow, electroless copper plating, carbon foam, vacuum assisted

CLC Number:

TB333

YANG Liu, LIU Xiu-Jun, LI Tong-Qi, HAN Rui-Lian, FENG Zhi-Hai. Effect of Plating Solution Flow Pattern on Preparation of Electroless Copper- Plated Carbon Foam under Vacuum and Ultrasonic Conditions[J]. Journal of Inorganic Materials, 2016, 31(1): 69-74.

Figures/Tables 11

Fig. 1 Schematic of vacuum and ultrasonic assisted flow electroless copper plating

Table 1 Plating solution composition and process conditions

Steps	Composition	Conditions
Degreasing	60 g/L NaOH 20 g/L Na₂CO₃ 20 g/L Na₃PO₄	50℃, 20 min
Roughening	60% HNO₃	25℃, 20 min
Sensitization	5% HCl 20 g/L SnCl₂	25 min
Activation	30 g/L AgNO₃	25 min; Vacuum, 10 min
Electroless copper plating	20 g/L CuSO₄•5H₂O 26 g/L Na₂EDTA•2H₂O 20 g/L C₁₁H₁₃KO₈•4H₂O 20 mL/L 2, 2-Bipyridine 20 mL/L methanal(37%)	Room temperature pH 12.2-12.5 Vacuum: 0.04-0.06 MPa Ultrasonic: 42 kHz, 100 W

Fig. 2 Ordinate cutting of Cu/carbon foam

Fig. 3 Copper coating weight gain rate vs height in different plating solution flow patterns

Fig. 4 Schematic of copper deposition on pore surface

Table 2 Macroscopic morphology of copper coating vs. height in different plating solution flow patterns (From A to B)

	CF2	CF3
Color	Bright red→Black	Copper red; Well-distributed
Compactness	Density↓ Porosity↑	Uniform and dense; Well-distributed
Smoothness	Leveling↓ Surface roughness↑	Smoothy and flat; Well-distributed

Fig. 5 SEM images of copper coating vs. height in different plating solution flow patterns

Fig. 6 Coating thickness vs. height in different plating solution flow patterns

Fig. 7 Compressive strength of Cu/carbon foam vs height in different plating solution flow pattern

Fig. 8 Conductivity of copper coating vs height in different plating flow patterns

Fig. 9 XRD patterns of Cu/carbon foam obtained at a bidirectional flow of plating solution

References 21

[1]	LI T Q, WANG C Y.Preparation and structure characterization of mesophase pitch-based carbon foam.Journal of Inorganic Materials, 2005, 20(6): 1438-1444.
[2]	KLETT J W, MCMILLAN A D, GALLEGO N C, et al.Effects of heat treatment conditions on the thermal properties of mesophase pitch-derived graphitic foams.Carbon, 2004, 42(8/9): 1849-1852.
[3]	KLETT J, HARDY R, ROMINE E, et al.High-thermal-conductivity mesophase pitch-derived carbon foams: effect of precursor on structure and properties.Carbon, 2000, 38(7): 953-973.
[4]	王妹先. 中间相沥青基泡沫炭的制备及性能研究. 天津: 天津大学硕士学位论文, 2008.
[5]	SIHN S, ROY A K.Modeling and prediction of bulk properties of open-cell carbon foams.J. Mech. Phys. Solids. , 2004, 52(1): 167-191.
[6]	WANG M X, WANG C Y, LI T Q, et al.Preparation of mesophase-pitch-based carbon foams at low pressures.Carbon, 2008, 46(1): 84-91.
[7]	LI S Z, SONG Y Z, SONG Y, et al.Carbon foams with high compressive strength derived from mixtures of mesocarbon microbeads and mesophase pitch.Carbon, 2007, 45(10): 2092-2097.
[8]	VIGNOLES G L, GABORIEAU C, DELETTREZ S, et al.Reinforced carbon foams prepared by chemical vapor infiltration: a process modeling approach.Surf. Coat. Tech. , 2008, 203(5/6/7): 510-515.
[9]	LAFDI K, ALMAJALI M, HUZAYYIN O.Thermal properties of copper-coated carbon foams.Carbon, 2009, 47(11): 2620-2626.
[10]	ALMAJALI M, LAFDI K, PRODHOMME P H, et al.Mechanical properties of copper-coated carbon foams.Carbon, 2010, 48(5): 1604-1608.
[11]	ALMAJALI M, LAFDI K.Assessment of carbon foam geometry during copper coating.Carbon, 2010, 48(15): 4238-4247.
[12]	BHAV SINGH B, BALASUBRAMANIAN M.Processing and properties of copper-coated carbon fibre reinforced aluminum alloy composites. J. Mater. Process. Technol. , 2009, 209(4): 2104-2110.
[13]	CHE D, YAO G C, GAO Z K.A precious metal-free electroless technique for the deposition of copper on carbon fibers.Metall. Mater. Trans. , 2012, 43(11): 4194-4199.
[14]	ZHAO P, PU Y P, HUANG C H, et al. Effect of adding ultrasonic on copper electroless plating of polyurethane foam.Materials Engineering, 2008(4): 43-46.
[15]	YANG C G, XIAO Y M, CHEN N, et al.A comprehensive survey of development of outgassing model for nonmetal materials in vacuum.Vacuum, 2006, 43(3): 48-50.
[16]	ZHAI L L, LIU X J, LI T Q, et al.Vacuum and ultrasonic co-assisted electroless copper plating on carbon foams.Vacuum, 2015, 114: 21-25.
[17]	ZHAI L L, LIU X J, LI T Q, et al.Without activation formaldehyde electroless copper plating in graphite plate deep hole and silt.Materials Reviews, 2014, 28(8): 99-103.
[18]	YU G, ZOU C, HU B N, et al.Research on preparation of Cu-coated graphite powders with ultrasonic flow electroplating copper.Journal of Hunan University, 2011, 38(2): 60-64.
[19]	李宁. 化学镀实用技术. 北京: 化学工业出版社, 2004: 265-307.
[20]	GUO Z C, LIU H K, WAN Z Y, et al.Present status and prospect of electroless plating deposits.Surface Technology, 1995, 24(6): 29-33.
[21]	CAO D, LI Z H.Preparation of siler-coated glass fiber by electroless plating with ultrasonic threatment.Materials Science and Engineering of Powder Metallurgy, 2009, 14(6): 422-426.