Effect of Plating Solution Flow Pattern on Preparation of Electroless Copper- Plated Carbon Foam under Vacuum and Ultrasonic Conditions
YANG Liu, LIU Xiu-Jun, LI Tong-Qi, HAN Rui-Lian, FENG Zhi-Hai
Journal of Inorganic Materials . 2016, (1): 69 -74 .  DOI: 10.15541/jim20150276