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无机材料学报

无机材料学报

• 研究论文 • 上一篇    下一篇

氧氮玻璃连接Si3N4陶瓷的可行性研究

解荣军; 黄莉萍; 陈源; 符锡仁   

  1. 中国科学院上海硅酸盐研究所; 上海 200050
  • 收稿日期:1996-10-29 修回日期:1900-01-01 出版日期:1997-12-20 网络出版日期:1997-12-20

Study on Feasibility of Joining Si3N4 Ceramics by Oxynitride Glass

XIE Rongjun; HUANG Liping; CHEN Yuan; FU Xiren   

  1. Shanghai Institute of Ceramics; Chinese Academy of Sciences Shanghai 200050 China
  • Received:1996-10-29 Revised:1900-01-01 Published:1997-12-20 Online:1997-12-20

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摘要： 本文采用Y－Si－Al－O－N系氧氮玻璃对Si3N4陶瓷进行1450、1600℃保温30min的润湿实验和连接实验．结果表明，氧氮玻璃对Si3N4的润湿性较好，1450℃时两者的热膨胀系数差异明显，而1600℃时热膨胀系数差异减小，接头附近存在扩散区．氧氮玻璃可以连接Si3N4陶瓷．

关键词: 氧氮玻璃, 连接, 润湿性, 热膨胀系数

Abstract: -Si-Al-O-N glass was used to bond and wet dense Si3N4 ceramic at 1450℃ and 16000℃ for30 min, respectively. The result showed that the oxynitride glass can wet well to Si3N4 ceramic.At 14500℃, there was obvious difference in the coefficients of thermal expansion of the glass andSi3N4, while at 16000℃, the difference decreased. A diffusion layer existed near the joint. Theoxynitride glass can be used to join Si3N4 ceramics.

Key words: oxynitride glass, joining, wettability, thermal expansion coefficient