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无机材料学报

无机材料学报

• 研究论文 • 上一篇    下一篇

熔盐热析出反应金属化Si3N4与Si3N4的连接

陈健; 潘伟; 郑仕远; 黄勇   

  1. 清华大学材料科学与工程系; 北京 100084
  • 收稿日期:1999-06-22 修回日期:1999-06-09 出版日期:2000-06-20 网络出版日期:2000-06-20

Joining of Molten Salt Reaction Metallized Si3N4 to Si3N4

CHEN Jian; PAN Wei; ZHENG Shi-Yuan; HUANG Yong   

  1. State Key Lab of New Ceramics and Fine Processing; Dept of Materials Science and Engineering; TsinghuaUniversity Beijing 100084; China
  • Received:1999-06-22 Revised:1999-06-09 Published:2000-06-20 Online:2000-06-20

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摘要： 在采用熔盐热析出反应在Si3N4陶瓷表面沉积钛金属膜的基础上，对CuAg合金在金属化表面的润湿性进行了研究，结果表明，CuAg合金能对采用该方法金属化的Si3N4陶瓷实现良好润湿．在此基础上，成功实现了钛金属化Si3N4陶瓷与Si3N4陶瓷的连接并对连接工艺进行了系统研究．连接界面的TEM研究发现，界面上广泛存在Ti-Cu－Si-N相并对这种相对连接强度的影响进行了讨论．

关键词: 钛, 金属化, 氮化硅, 连接, 界面结构

Abstract: Based on the deposition of titanium films on Si3N4 surface by molten salt reactions, the wetting behavior of a liquid CuAg eutectic
alloy on the titanium metallized Si3N4 was studied, it was found that, the metallized sample can be fully wetted by the eutectic
alloy. Based on this result, the joining of metallized Si3N4 to Si3N4 was successfully obtained and the joining technique
was systematically studied. TEM observation on the interfacial structure of the joints found that Ti-Cu-Si-N phases widely existed
at the interface and their possible effects on the shear strength of the joints were also discussed.

Key words: titanium, metallization, Si3N4, joining, interfacial structure

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