2D C/SiC and niobium alloy NbHf10-1M were successfully joined. The joining material, posited between 2D C/SiC and NbHf10-1M, was a lamination formed by a main interlayer of Ti-Cu and an assistant interlayer of Cu. The joining process consisted of solid diffusion bonding and transient liquid phase diffusion bonding (TLP-DB). The study shows that the increase of the thickness of assistant interlayer Cu can decrease the thermal stress in joint. The Ti-Cu liquid alloy formed in TLP-DB process, has good wettability with C/SiC and easily infiltrates into C/SiC and wrapes the C fibers on the joining surface.
The highest shear stress of joint is 14.1 MPa.
XIONG Jiang-Tao
,
LI Jing-Long
,
ZHANG Fu-Sheng
,
HUANG Wei-Dong
. Joining of 2D C/SiC Composites with Niobium Alloy[J]. Journal of Inorganic Materials, 2006
, 21(6)
: 1391
-1396
.
DOI: 10.3724/SP.J.1077.2006.01391
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