Journal of Inorganic Materials

   

Improved Hole Density and Electrical Properties of Bi0.64Sb1.36Te3 Epitaxial Thermoelectric Thin Films via in-situ Annealing

LI Xianda1,2, WU Yichen1,3, LIU Wei1, TANG Xinfeng1   

  1. 1. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, China;
    2. International School of Materials Science and Engineering (School of Materials and Microelectronics), Wuhan University of Technology, Wuhan 430070, China;
    3. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
  • Received:2026-04-14 Revised:2026-05-28
  • Contact: LIU Wei, professor. E-mail: w.liu@whut.edu.cn
  • About author:LI Xianda (2000-), male, PhD candidate. E-mail: wuyichen@whut.edu.cn
  • Supported by:
    The National Key R&D Program of China (2021YFA0718700); National Natural Science Foundation of China (52571255)

Abstract: p-type (Bi,Sb)2Te3 thin films serve as an important material platform for the research of thin-film thermoelectric devices, and the optimization of their performances has attracted extensive attentions in the thermoelectric community. Thermal annealing is regarded as an effective strategy to simultaneously optimize hole concentration and crystalline quality, yet its optimization effect is usually unsatisfactory. To explore the underlying mechanism, p-type Bi0.64Sb1.36Te3 thin films with high crystalline quality and optimized composition were fabricated via molecular beam epitaxy, and the effects of annealing on their microstructure and electrical transport properties were systematically investigated. It was found that in-situ annealing at 580 K optimizes hole density and mobility at the same time, which originates from the introduction of intrinsic Bi/SbTe' antisite defects and the improvement of thin-film crystalline quality. This indicated that the optimization of point defects and crystalline quality are crucial for enhancing films’ electrical properties via annealing. The Bi0.64Sb1.36Te3 thin film annealed at 580 K for 2 h possessed a hole density of 4.05×1019 cm-3 and achieved the best overall electrical properties among all samples. Multi-valence bands participate in electrical transport, leading to an outstanding room-temperature power factor of 5.14 mW·m-1·K-2 which represents one of the highest values for this thin-film material system.

Key words: Bi2-xSbxTe3 based thin film, molecular beam epitaxy, in-situ annealing, electrical transport property

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