Fabrication and Planar Cooling Performance of Flexible Bi0.5Sb1.5Te3/epoxy Composite Thermoelectric Films

doi:10.15541/jim20180528

Abstract

Abstract:

Flexible Bi_0.5Sb_1.5Te₃/epoxy composite thermoelectric films were prepared on polyimide substrates by screen printing. Its electrical transport properties are enhanced by optimizing the content of Bi_0.5Sb_1.5Te₃ powder. The highest power factor of the optimized Bi_0.5Sb_1.5Te₃/epoxy films reached 1.12 mW·m ^-1·K ^-2at 300 K, increased by 33% as compared with previous value. The anti-bending test results show that resistance of the thick films remains unchanged when the bending radius is over 20 mm and slightly increases within 3000 bending cycles when the bending radius is 20 mm, implying that the as-prepared films have potential application in flexible TE devices. The flexible thermoelectric leg could establish a temperature difference from 4.2 ℃ to 7.8 ℃ under working current from 0.01 A to 0.05 A, showing potential application in planar cooling field.

Key words: flexible thermoelectric films, screen printing, Bi_0.5Sb_1.5Te₃/epoxy composite films, electrical property, planar cooling field

CLC Number:

TQ174

Peng LI, Xiao-Lei NIE, Ye TIAN, Wen-Bing FANG, Ping WEI, Wan-Ting ZHU, Zhi-Gang SUN, Qing-Jie ZHANG, Wen-Yu ZHAO. Fabrication and Planar Cooling Performance of Flexible Bi_0.5Sb_1.5Te₃/epoxy Composite Thermoelectric Films[J]. Journal of Inorganic Materials, 2019, 34(6): 679-684.

Figures/Tables 7

References 27

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x	ρ/(g·cm^-3)	R_H/(×10^-1, cm³·C^-1)	n/(×10¹⁹, cm^-3)	μ_H/(cm²·V^-1·s^-1)	σ/(×10⁴, S·m^-1)
6.5	3.93	3.72	1.67	45.15	1.21
7	4.08	3.69	1.69	52.17	1.41
8	4.32	3.57	1.74	58.85	1.65
9	4.19	3.56	1.73	54.69	1.51
10	4.05	3.55	1.72	50.59	1.40

x	ρ/(g·cm^-3)	R_H/(×10^-1, cm³·C^-1)	n/(×10¹⁹, cm^-3)	μ_H/(cm²·V^-1·s^-1)	σ/(×10⁴, S·m^-1)
6.5	3.93	3.72	1.67	45.15	1.21
7	4.08	3.69	1.69	52.17	1.41
8	4.32	3.57	1.74	58.85	1.65
9	4.19	3.56	1.73	54.69	1.51
10	4.05	3.55	1.72	50.59	1.40

Materials	Fabrication process	Annealing methods	σ/(×10⁴, S·m^-1)	α²σ/(mW·m^-1·K^-2)	Ref.
Bi_0.5Sb_1.5Te₃+epoxy	Screen printing	573 K, 4 h, hot pressing	1.67	1.12	This work
Bi_0.5Sb_1.5Te₃ ink	Inkjet printing	673 K, 30 min	0.20	0.07	[10]
Bi_0.5Sb_1.5Te₃+8%Te-epoxy	Dispenser printing	523 K	0.11	0.06	[14]
Bi_0.5Sb_1.5Te₃+C₂₄H₄₄O₆	Brush-printed	673 K, 4 h	0.29	0.15	[17]
Bi₂Te₃+1%Se-epoxy	Dispenser printing	623 K, 12 h	1.03	0.26	[20]
Bi_0.5Sb_1.5Te₃+epoxy	Brush-printed	623 K, 4 h, hot pressing	1.15	0.84	[22]
Bi_0.5Sb_1.5Te₃+8%Te-polymer	Dispenser printing	523 K	0.13	0.16	[25]

Materials	Fabrication process	Annealing methods	σ/(×10⁴, S·m^-1)	α²σ/(mW·m^-1·K^-2)	Ref.
Bi_0.5Sb_1.5Te₃+epoxy	Screen printing	573 K, 4 h, hot pressing	1.67	1.12	This work
Bi_0.5Sb_1.5Te₃ ink	Inkjet printing	673 K, 30 min	0.20	0.07	[10]
Bi_0.5Sb_1.5Te₃+8%Te-epoxy	Dispenser printing	523 K	0.11	0.06	[14]
Bi_0.5Sb_1.5Te₃+C₂₄H₄₄O₆	Brush-printed	673 K, 4 h	0.29	0.15	[17]
Bi₂Te₃+1%Se-epoxy	Dispenser printing	623 K, 12 h	1.03	0.26	[20]
Bi_0.5Sb_1.5Te₃+epoxy	Brush-printed	623 K, 4 h, hot pressing	1.15	0.84	[22]
Bi_0.5Sb_1.5Te₃+8%Te-polymer	Dispenser printing	523 K	0.13	0.16	[25]

Fabrication and Planar Cooling Performance of Flexible Bi_0.5Sb_1.5Te₃/epoxy Composite Thermoelectric Films

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