无机材料学报

• 研究论文 •    

晶粒尺寸对常压固相烧结SiC陶瓷断裂强度Weibull分布的影响

曹娟1,2, 吴西士1,3, 刘泽华1,3, 裴兵兵1,3, 韩建燊1,3, 刘欢1,3, 杨亦天1,3, 吴海波1,3, 黄政仁1,3   

  1. 1.中国科学院宁波材料技术与工程研究所,海洋关键材料全国重点实验室,宁波 315201;
    2.宁波大学材料科学与化学工程学院,宁波 315211;
    3.宁波杭州湾新材料研究院,宁波 315336
  • 收稿日期:2025-05-14 修回日期:2025-06-27
  • 作者简介:曹娟(2000-),女,硕士研究生. E-mail: caojuan@nimte.ac.cn
  • 基金资助:
    国家重点研发计划资助(2022YFB3706200); 国家自然科学基金资助项目(U23A20563)

Influence of Grain Size on the Weibull Distribution of Fracture Strength in Atmospheric-pressure Solid-phase Sintered SiC Ceramics

CAO Juan1,2, WU Xishi1,3, LIU Zehua1,3, PEI Bingbing1,3, HAN Jianshen1,3, LIU Huan1,3, YANG Yitian1,3, WU Haibo1,3, HUANG Zhengren1,3   

  1. 1. State Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China;
    2. School of Materials Science and Chemical Engineering, Ningbo University, Ningbo 315211, China;
    3. Qianwan Institute of CNITECH, Ningbo 315336, China
  • Received:2025-05-14 Revised:2025-06-27
  • About author:Cao Juan (2000-), female, Master candidate. E-mail: caojuan@nimte.ac.cn
  • Supported by:
    National Key R&D Program of China (2022YFB3706200); National Natural Science Foundation of China (U23A20563)

摘要: 碳化硅陶瓷因其优异的力学性能以及抗高温蠕变、耐酸碱腐蚀、高热导等优良性能在半导体、核能、航空航天、海洋等领域得到广泛应用。然而,脆性陶瓷材料的断裂强度通常表现出显著的离散性,这降低了可靠性,限制了工程结构中的应用。本研究通过调节晶粒尺寸,提升了常压固相烧结碳化硅(SSiC)陶瓷的断裂强度可靠性。系统研究了晶粒尺寸对SSiC陶瓷力学性能、断裂强度Weibull分布以及裂纹扩展阻力曲线(R曲线)特征的影响,深入分析了SSiC陶瓷断裂强度可靠性的调控机理。结果表明:随着烧结温度从2100β℃升高至2200β℃,SSiC陶瓷平均晶粒尺寸从3.01βµm增大至8.45βµm,晶粒分布均匀性系数从0.70降低至0.62。同时,随着平均晶粒尺寸从8.45βµm减小至3.01βµm,SSiC陶瓷断裂强度Weibull模数从8.5逐渐增大至12.2,增幅达到44%,表明晶粒细化对提高断裂强度可靠性具有积极作用。晶粒细化对断裂强度Weibull模数提高的主要原因在于高密度晶界网络通过裂纹分叉与桥接效应分散应力集中,同时均匀的晶粒分布和较低的缺陷尺寸提升了裂纹扩展的能量阈值,从而表现出上升的R曲线行为。本研究通过调控晶粒尺寸明显改善了碳化硅陶瓷的断裂强度可靠性,有望推动碳化硅陶瓷材料更广泛的工程化应用。

关键词: 碳化硅陶瓷, 晶粒尺寸, 可靠性, Weibull模数, 缺陷控制

Abstract: Silicon carbide (SiC) ceramics have found extensive application in strategic fields, such as semiconductor technology, nuclear energy, aerospace engineering, and marine engineering. This is attributed to their remarkable properties, which encompass excellent mechanical properties, resistance to high-temperature creep, acid and alkali corrosion, and high thermal conductivity. However, the fracture strength of these brittle ceramic materials typically exhibits significant discreteness, which adversely affects reliability and limits their wider application as engineering structural materials. In this work,the reliability of fracture strength in solid-state sintered silicon carbide (SSiC) ceramics was enhanced through the regulation of grain size. The influence of grain size on the mechanical properties, Weibull distribution of fracture strength, and Crack entension resistance curve (R-curve) characteristics of SSiC ceramics were systematically evaluated. The reliability regulatory mechanism for the fracture strength of SSiC ceramics was analyzed. The results indicate that, with an increase in sintering temperature from 2100β℃ to 2200β℃, the average grain size of SSiC ceramics increased from 3.01βµm to 8.45βµm, while the coefficient of grain size distribution uniformity dropped from 0.70 to 0.62. As the average grain size was reduced from 8.45βµm to 3.01βµm, the Weibull modulus of fracture strength for SSiC ceramics increased gradually from 8.5 to 12.2, representing a 44% increase. This clearly indicates the positive impact of grain refinement on the reliability of fracture strength. The enhancement in the Weibull modulus of fracture strength as a result of grain refinement can primarily be attributed to the high-density grain boundary network, which effectively mitigates stress concentration via crack bifurcation and bridging mechanisms. Additionally, the uniformity of grain distribution and reduced defect size contribute to an elevated energy threshold for crack propagation, leading to an ascending R-curve behavior. This work achieved a significant improvement in the fracture strength reliability of silicon carbide ceramics through the regulation of grain size, which is expected to promote the wider engineering application of silicon carbide ceramic materials.

Key words: silicon carbide ceramics, grain size, reliability, Weibull modulus, defect control

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