Interface Structure and Electrical Property of Yb0.3Co4Sb12/Mo-Cu Element Prepared by Welding Using Ag-Cu-Zn Solder
TANG Yun-Shan, BAI Sheng-Qiang, REN Du-Di, LIAO Jin-Cheng, ZHANG Lan-Ting, CHEN Li-Dong
Journal of Inorganic Materials . 2015, (3): 256 -260 .  DOI: 10.15541/jim20140378