×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
×
ISSN:1000-324X CN:31-1363/TQ
Adv. Search
Figure Search
Journal of Inorganic Materials
Home
Journal introduction
Journal introduction
Editorial board
Database collection
impact factor
Young editorial board
Readers
Accepted
Current Issue
Archive
Most Read
Most Download
Subscription
Authors
Author Submission
Author Guide
Download
Reviewing
Member Login
Peer Review
Editor-in-Chief
Office Work
Recommend
Feature Articles
Hot Articles
Special Issues
Contact Us
Contact
Message Board
Email Alert
中文
Bonding Mechanism of Direct Bond Copper to Alumina Substrate
FANG Zhi-Yuan,ZHOU He-Ping,CHEN Hu
Journal of Inorganic Materials . 2000, (
4
): 641 -646 .
