Adv. Search
Journal of Inorganic Materials

Journal of Inorganic Materials >

2009 , Vol. 24 >Issue 3: 636 - 640

DOI: https://doi.org/10.3724/SP.J.1077.2009.00636

Research Paper

Microstructure and Mechanical Property Analysis of AlN Ceramic with Mo-Ni-Cu Alloy Active Brazed Joints

  • ZHANG Ling-Yan ,
  • QIN Ming-Li ,
  • QU Xuan-Hui ,
  • LU Yan-Jie ,
  • ZHANG Xiao-Yong
Expand
  • 1. Institute of Powder Metallurgy, University of Science and Technology Beijing, Beijing 100083, China; 2. General Research Institute for Nonferrous Metals, Beijing 100088, China

Received date: 2008-08-19

  Revised date: 2008-10-30

  Online published: 2009-05-20

Fold

Abstract

AlN ceramic is a highperformance electronic packaging material, but it is difficult to joint with metals directly. AlN ceramic and Mo-Ni-Cu alloy was brazed using 98（Ag28Cu）2Ti active filler alloy in vacuum. EBSD, EDS and XRD were used to study the microstructure and phases of bonding area and the surface of the sheared sample. The mechanical properties and hermeticity performance were measured. It is found that TiN exists in the interface of AlN ceramic, which indicate that there is a chemical bond between ceramic and filler metal, but there is a few of Ni-Ti intermetallics in the interface of MoNi-Cu alloy. TiN and AlN are found on the sheared fracture surface, which indicate that fracture occurrs from the bonding area near the AlN ceramic. The sample has good performance with gas leakage rate of 1.0×10-11Pa·m3/s, average bending strength of σｂ=78.55MPa and shear strength of στ=189.58MPa.

Key words： Ti-Ag-Cu active filler alloy; active brazing; microstructure analysis; mechanical properties

Cite this article

ZHANG Ling-Yan , QIN Ming-Li , QU Xuan-Hui , LU Yan-Jie , ZHANG Xiao-Yong . Microstructure and Mechanical Property Analysis of AlN Ceramic with Mo-Ni-Cu Alloy Active Brazed Joints[J]. Journal of Inorganic Materials, 2009 , 24(3) : 636 -640 . DOI: 10.3724/SP.J.1077.2009.00636

References

1］Mandal S, Ray A K, Ray A K. Materials Science and Engineering A, 2004, 383(2): 235-244.
［2］Slack G A, Tranzili R A. J. Phy. Chem. Solids, 1987, 48(7): 641-648.
［3］刘 鑫,张小勇,陆艳杰. 真空电子技术, 2007, (4): 56-58.
［4］鲁燕萍,高陇桥. 真空科学与技术, 2000, 20(3): 190-193.
［5］Zhu S, Wosiński W. Journal of Materials Processing Technology, 2001, 109(3): 277-282.
［6］李增峰,汤慧萍,刘海彦. 粉末冶金材料科学与工程, 2006, 11(3): 185-190.
［7］曲仕尧,邹增大,王新洪. 焊接学报, 2003, 24(4): 13-16.
［8］Arróyave R, Eagar T W. Acta Meterialia, 2003, 51(16): 4871-4880.
［9］ZHANG Chunguang, QIAO Guanjun, JIN Zhihao. Journal of the European Ceramic Society, 2002, 22(13): 2181-2186.
［10］Taranets N Y, Jones H. Materials Science and Engineering A, 2004, 379(1-2): 251-257.
［11］GómezGarcía D, GutiérrezMora F, GallardoLópez , et al. Journal of the European Ceramic Society, 2007, 27(11): 3307-3310.
［12］Kim T W, Chang H, Park S W. Ceramic Engineering and Science Proceedings, 2002, 23(4):843-848.
［13］Dezellus O, Andrieux J, Bosselet F, et al. Materials Science and Engineering A, 2008, 495(1-2): 254-258.
Options
Outlines

/

〈 〉