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Journal of Inorganic Materials

Journal of Inorganic Materials >

2007 , Vol. 22 >Issue 6: 1201 - 1205

DOI: https://doi.org/10.3724/SP.J.1077.2007.01201

Research Paper

Thermal Conductivity of Electric Molding Composites Filled with β-Si3N4

  • HU Yuan ,
  • CHEN Ke-Xin ,
  • JIN Hai-Bo ,
  • FU Ren-Li
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  • (1. State Key of New Ceramics and Fine Processing, Department of Materials Science & Engineering, Tsinghua University, Beijing 100084, China; 2. Discipline of Materials Science & Engineering, Beijing Institute of Technology, Beijing 100081, China; 3. Discipline of Materials Science & Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China)

Received date: 2006-11-13

  Revised date: 2007-05-15

  Online published: 2007-11-20

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Abstract

New electric molding composites were fabricated with hybridizing epoxy and β-Si3N4 instead of silica. The thermal conductivity of composites filled with β-Si3N4 was compared with that co-filled with β-Si3N4 and SiO2. The results demonstrate that the thermal conductivity of the composite increases obviously with the increasing of β-Si3N4 content. Thermal conductivity of β-Si3N4-filled composite is about 3.8 times as large as that of SiO2-filled one when the additional volume fraction achieves to 50%. Based on the experimental results, the discussion of calculating model for predicting thermal conductivity of composites shows that Agari model is more applicable to predict the thermal conductivities of β-Si3N4 filled and β-Si3N4/SiO2 co-filled composites. Furthermore, a common expression of Agari model for co-filled composites and its parameters are given.

Key words： β-Si3N4; SiO2; electric molding composite; thermal conductivity

Cite this article

HU Yuan , CHEN Ke-Xin , JIN Hai-Bo , FU Ren-Li . Thermal Conductivity of Electric Molding Composites Filled with β-Si3N4[J]. Journal of Inorganic Materials, 2007 , 22(6) : 1201 -1205 . DOI: 10.3724/SP.J.1077.2007.01201

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