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无机材料学报

无机材料学报 >

2009 , Vol. 24 >Issue 6: 1147 - 1150

DOI: https://doi.org/10.3724/SP.J.1077.2009.01147

研究论文

基于光敏浆料的直写精细无模三维成型

  • 孙竞博 ,
  • 李 勃 ,
  • 黄学光 ,
  • 蔡坤鹏 ,
  • 周 济 ,
  • 李龙土
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  • (1.清华大学 材料科学与工程系 新型陶瓷与精细工艺国家重点实验室, 北京 100084; 2. 清华大学 深圳研究生院 新材料研究所, 深圳 518055 )

收稿日期: 2009-03-05

  修回日期: 2009-04-14

  网络出版日期: 2010-04-22

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Directwrite Assembly of Ceramic Threedimensional Structures Based on Photosensitive Inks

  • SUN Jing-Bo ,
  • LI Bo ,
  • HUANG Xue-Guang ,
  • CAI Kun-Peng ,
  • ZHOU Ji ,
  • LI Long-Tu
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  • (1. State Key Laboratory of New Ceramics and Fine Processing, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China; 2. Research Institute for Advanced Materials, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China )

Received date: 2009-03-05

  Revised date: 2009-04-14

  Online published: 2010-04-22

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摘要

配制了一种具有光敏特性的陶瓷浆料, 并用此浆料通过直写精细无模三维成型技术制备了线条直径为300μm的BaTiO3陶瓷基木堆结构. 系统地讨论了光敏浆料的配制方法、浆料直写无模成型的工作原理以及采用的烧结工艺. 制备过程中不同阶段的研究表明, 光敏浆料中的BaTiO3纳米颗粒在烧结前未发生团聚, 从而保证挤压成型顺利进行; 烧结后样品成瓷效果好, 各向收缩均匀, 整体无变形、开裂. 该技术具有成型速度快、制造周期短、可用材料范围广等特点.

关键词： 直写成型; 陶瓷; 光固化

本文引用格式

孙竞博 , 李 勃 , 黄学光 , 蔡坤鹏 , 周 济 , 李龙土 . 基于光敏浆料的直写精细无模三维成型[J]. 无机材料学报, 2009 , 24(6) : 1147 -1150 . DOI: 10.3724/SP.J.1077.2009.01147

Abstract

A novel kind of photosensitive ceramic inks was developed for DirectWrite Assembly and a BaTiO3 based woodpile structure with filament diameter of about 300μm was fabricated through this method. The preparation of the photosensitive inks, the principle of the Direct Ink Write (DIW) and the sintering schedule were investigated. The analyses at different states in the process show that the BaTiO3 particles keep monodisperse before sintering, which ensures a feasible extrusion of the ink. Moreover, the sintered products exhibit a fine ceramic forming result and isotropic contraction, with little deformation and few cracks. As a powerful molding technique, the DIW has merits of rapicl processing and good compatibility with various materials.

Key words： directwrite; ceramic; ultraviolet curing

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