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压电陶瓷晶粒取向生长技术的研究进展

  • 杜红亮 ,
  • 张孟 ,
  • 苏晓磊 ,
  • 周万城 ,
  • 裴志斌 ,
  • 屈绍波
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  • 1. 西北工业大学凝固技术国家重点实验室, 西安 710072; 2. 空军工程大学理学院, 西安 710051; 3. 西安交通大学电子陶瓷与器件教育部重点实验室, 西安 710049

收稿日期: 2007-01-25

  修回日期: 2007-05-16

  网络出版日期: 2008-01-20

Developments of Grain Oriented Growth Techniques of Piezoelectric Ceramics

  • DU Hong-Liang ,
  • ZHANG Meng ,
  • SU Xiao-Lei ,
  • ZHOU Wan-Cheng ,
  • PEI Zhi-Bin ,
  • QU Shao-Bo
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  • 1. State Key Laboratory of Solidification Processing, Northwestern
    Polytechnical University, Xi’an 710072, China; 2. The College of Science, Air Force
    Engineering University, Xi’an 710051, China; 3. Electronic Materials Research Laboratory, Key Laboratory of Educational Ministry, Xi’an Jiaotong University,
    Xi’an 710049, China

Received date: 2007-01-25

  Revised date: 2007-05-16

  Online published: 2008-01-20

摘要

由于取向生长技术可以显著地提高压电陶瓷的性能, 并且不会降低材料的居里温度, 故压电陶瓷的晶粒取向生长技术已成为研究的热点. 本文分别从定向凝固技术、多层晶粒生长技术、模板晶粒生长技术和反应模板晶粒生长技术等四个方面,归纳和分析了近年来压电陶瓷晶粒取向生长技术的研究进展,并对压电陶瓷晶粒取向生长技术今后的研究和发展提出一些建议.

本文引用格式

杜红亮 , 张孟 , 苏晓磊 , 周万城 , 裴志斌 , 屈绍波 . 压电陶瓷晶粒取向生长技术的研究进展[J]. 无机材料学报, 2008 , 23(1) : 1 -7 . DOI: 10.3724/SP.J.1077.2008.00001

Abstract

The grain orientation techniques of piezoelectric ceramics have attracted considerable attention because the grain oriented piezoelectric ceramics possess higher piezoelectric properties than polycrystalline ceramics and have the same Curie temperature as polycrystalline ceramics. In this paper, the research progress and trend of grain orientation techniques of piezoelectric ceramics are summarized with emphases on directional solidification technology, multilayer grain growth technique, templated grain growth and reactive templated grain growth technique. The future for the developments of grain orientation techniques of piezoelectric ceramics are also proposed.

参考文献

[1] Uchino K. Ferroelectric Devices, London and New York: Marcel Dekker Inc, 2000. [2] Jaffe B, Cook W R, Jaffe H. Piezoelectric Ceramics, New York: Academic Press, 1971. [3] Park S E, Shrout T R. J. Appl. Phys., 1997, 82 (4): 1804--1811.
[4] Service R E. Science, 1997, 275 (3): 1878--1878.
[5] 张孝文, 陈克丕(ZHANG Xiao-Wen, et al). 无机材料学报(Journal of Inorganic Materials), 2002, 17 (3): 385--391.
[6] 孙士文, 潘晓明, 李东林, 等(SUN Shi-Wen, et al). 无机材料学报(Journal of Inorganic Materials), 2004, 19 (3): 541--545.
[7] 王评初, 孙士文, 潘晓明, 等(WANG Ping-Chu, et al) 无机材料学报(Journal of Inorganic Materials), 2004, 19 (5): 1195--1198.
[8] Messing G L, Trolier-Mckinstry S, Sabolsky E M, et al. Critical Reviews in Solid State and Materials Science, 2004, 29 (2): 45--96.
[9] Kimura T. J. Ceram. Soc. Jpn., 2006, 114 (1): 15--25.
[10] Neurgaonkar R R, Oliver J R, Cory W K, et al. Ferroelectrics, 1994, 160 (2): 265--267.
[11] Zhao L L, Gao F, Zhang C S, et al. Journal of Crystal Growth, 2005, 276 (3-4): 446--452.
[12] Saito Y, Hisaaki T, Tani T, et al. Nature, 2004, 432 (11): 84--87.
[13] Tani T, Kimura T. Advances in Applied Ceramics, 2006, 105 (1): 55--63. [14] Lotgering F K. J. Inorg. Nucl. Chem., 1959, 9 (1): 113--115.
[15] 张孝文. 硅酸盐学报, 1983, 11 (2): 141--148.
[16] Sun S W, Pan X M, Wang P C. Appl. Phys. Lett., 2004, 84 (4): 574--576.
[17] Sabolsky E M, James A R, Kwon S, et al. Appl. Phys. Lett., 2001, 78 (17): 2551--2553.
[18] Kelly J, Leonard M, Tantigate C, et al. J. Am. Ceram. Soc., 1997, 80 (4): 957--959.
[19] Viehland D, Li J F, Amin A. J. Appl. Phys., 2002, 92 (12): 3985.
[20] 李永祥, 杨群保, 曾江涛, 等. 四川大学学报, 2005, 48 (2): 230--235.
[21] 曾江涛, 李永祥, 杨群保, 等. 电子材料与元件, 2004, 23 (11): 66--70.
[22] Jing X Z, Li Y X, Yang Q B, et al. Ceramics International, 2004, 30 (7): 1889--1893.
[23] Jing X Z, Li Y X, Yang Q B, et al. Journal of the European Ceramic Society, 2005, 25 (12): 2727--2730.
[24] Sabolsky E M, Trolier-Mckinstry S, Messing G L, et al. J. Appl. Phys., 2003, 93 (7): 4072--4080.
[25] Yilmaz H, Messing G L, Trolier-McKinstry S. Journal of Electroceramics, 2003, 11 (3): 207--215.
[26] Yilmaz H, Trolier-McKinstry S, Messing G L. Journal of Electroceramics, 2003, 11 (3): 217--226.
[27] Suvaci E, Oh K S, Messing G L, et al. Acta Materialia, 2001, 49 (11): 2075--2081.
[28] Suvaci E, Messing G L. J. Am. Ceram. Soc., 2000, 83 (8): 2041--2048.
[29] Seabaugh M M, Messing G L, Vaudin M D. J. Am. Ceram. Soc., 2000, 83 (12): 3109--3116.
[30] Kimura T, Sakuma Y, Murata M. Journal of the European Ceramic Society, 2005, 25 (12): 2227--2230.
[31] Kimura T, Miura Y, Fuse K. Int. J. Appl. Ceram. Technol., 2005, 2 (1): 15--23.
[32] Sugawara T, Nomura Y, Kimura T, et al. J. Ceram. Soc. Jpn., 2001, 109 (10): 897--900.
[33] Muramatsu H, Kimura T. Journal of Electroceramics, 2004, 13 (1-3): 531--535.
[34] Tani T. J. Korean Phys. Soc., 1998, 32 (S2): 1217--1220.
[35] Seno Y, Tani T. Ferroelectrics, 1999, 224 (1-4): 793--800.
[36] Tani T. J. Ceram. Soc. Jpn., 2006, 114 (5): 363--370.
[37] Takeuchi T, Tani T, Saito Y. Jpn. J. Appl. Phys., 1999, 38 (9B): 5553--5556.
[38] Tani T, Itahara H, Xia C T, et al. Journal of Materials Chemistry, 2003, 13 (8): 1865--1867.
[39] Kimura T, Takahashi T, Tani T, et al. J. Am. Ceram. Soc., 2004, 87 (8): 1424--1429.
[40] Cross E. Nature, 2004, 432 (11): 24--25.
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