选用β-Si3N4粉体代替传统的SiO2填料与环氧树脂复合, 制备新型高导热电子模塑料. 初步研究了单独添加β-Si3N4及与SiO2复合添加对复合材料导热性能的影响. 结果表明: β-Si3N4粉体可以显著提高复合材料的导热性能, 当填充率达到50vol%时, β-Si3N4填充复合材料热导为SiO2填充复合材料的约3.8倍. 并在实验基础上, 探讨了复合材料的热导率计算模型, 给出了单一填充和复合填充复合材料的Agari热导率计算模型表达式及相关参数.
New electric molding composites were fabricated with hybridizing epoxy and β-Si3N4 instead of silica. The thermal conductivity of composites filled with β-Si3N4 was compared with that co-filled with β-Si3N4 and SiO2. The results demonstrate that the thermal conductivity of the composite increases obviously with the increasing of β-Si3N4 content. Thermal conductivity of β-Si3N4-filled composite is about 3.8 times as large as that of SiO2-filled one when the additional volume fraction achieves to 50%. Based on the experimental results, the discussion of calculating model for predicting thermal conductivity of composites shows that Agari model is more applicable to predict the thermal conductivities of β-Si3N4 filled and β-Si3N4/SiO2 co-filled composites. Furthermore, a common expression of Agari model for co-filled composites and its parameters are given.
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