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高温退火对反应溅射制备的a-SiC:H薄膜结构的影响

王印月; 王辉耀; 王吉政; 郭永平; 陈光华   

  1. 兰州大学物理系; 兰州730000
  • 收稿日期:1996-04-08 修回日期:1996-06-20 出版日期:1997-06-20 网络出版日期:1997-06-20

Effect of High-Temperature Annealing on the Structure of Reactive-Sputtering a-SiC:H Films

WANG Yinyue; WANG Huiyao; WANG Jizheng; GUO Yongping; CHEN Guanghua   

  1. Department of Physics; Lanzhou University Lanzhou 730000 China
  • Received:1996-04-08 Revised:1996-06-20 Published:1997-06-20 Online:1997-06-20

摘要: 通过红外透射谱、拉曼散射谱和X射线衍射谱的测量,研究了反应溅射制备的氢化非晶硅碳膜(SP-a-SiC:H)高温退人处理后的结构变化。发现在等时退火的情况下,退火温度对薄膜结构影响明显,H原子的逸出温度与键合有关,H从CHn中逸出要比从SiHn键中追出需要更高的温度,样品经800℃退火后,a-SiC:H膜转化为μc-SiC膜

关键词: 高温退火, 反应溅射, a-SiC:H薄膜, 结构调整

Abstract:

Using infrared transimissing, airman scattering, and X-ray diffraction spectroscopy, the authors investigated the effect of annealing temperature on the structure of amorphous hydrogenatedsilicon carbide (a-SiC:H) films prepared by the reactive sputtering method. It is found that annealing at temperature up to 800℃ results in evacuation of hydrogen atoms. Moreover, the annealingtemperature corresponding to the evacuation of H atom from CHnbonds is higher than thatof R evacuation from SiHn bonds. The annealing produces structural rearrangements, and the amorphous phase begins to transform into the microcrystalline phase at approximate 800℃.

Key words: high-temperature annealing, reactive-sputtering, a-SiC:H flms, structural rearrangement