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无机材料学报

无机材料学报

• 研究论文 • 上一篇    下一篇

Al2O3基板直接敷铜法的敷接机理研究

方志远; 周和平; 陈虎   

  1. 清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室, 北京 100084
  • 收稿日期:1999-07-22 修回日期:1999-09-20 出版日期:2000-08-20 网络出版日期:2000-08-20

Bonding Mechanism of Direct Bond Copper to Alumina Substrate

FANG Zhi-Yuan; ZHOU He-Ping; CHEN Hu   

  1. State Key Laboratory of New Ceramics and Fine Processing; Department of Materials Science and Engineering; Tsinghua University Beijing 100084 China
  • Received:1999-07-22 Revised:1999-09-20 Published:2000-08-20 Online:2000-08-20

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摘要： 本文采用直接敷铜工艺， １０７０℃流动氮气氛下保温３ｈ制得剥离强度达１１．５Ｋｇ／ｃｍ２的直接敷铜Ａｌ２Ｏ３基板．界面产物ＣｕＡＩＯ２的形成是获得较高结合强度的关键．敷接温度下，在界面上产生了能很好润湿Ａｌ２Ｏ３表面的Ｃｕ［Ｏ］共晶液体，并反应生成了连续的ＣｕＡＩＯ２层降温时，共晶液体从Ｃｕ侧开始固化并淀析出Ｃu２Ｏ颗粒．当固化前沿与ＣｕＡＩＯ２层相遇时，液相参与的界面反应停止．冷却至室温，即可获得Ｃｕ和Ａｌ２Ｏ３基板之间的牢固结合．

关键词: 直接敷铜法, 剥离强度, 界面产物

Abstract: Cu-Cu2O eutectic bonding of copper to Al2O3 was investigated. The highest peel strength was 11.5kg/cm for the specimen prepared at 1070℃ for 3h in nitrogen atmosphere. Oxygen promoted the wetting between
copper and Al2O3 greatly. Cu[O] melt reacted with the alumina and formed a continuous CuAlO2 layer, which enhanced the peel strength of the joint. On
cooling, the solidification front moved from the solid copper towards alumina, and Cu2O precipitated from the Cu[O] melt. When the solidification front met
the CuAlO2 layer, liquid-aided reaction completed and a reliable bond was achieved between the copper and Al2O3 substrate.

Key words: direct bonded copper(DBC), peel strength, interfacial product

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