多层片式电感器介质材料及其工艺的发展现状

无机材料学报

多层片式电感器介质材料及其工艺的发展现状

罗凌虹; 周和平; 黄河激; 王少洪

清华大学材料工程系新型陶瓷与精细工艺国家重点实验室北京 100084

收稿日期:2000-11-29 修回日期:2001-02-20 出版日期:2001-11-20 网络出版日期:2001-11-20

Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors

LUO Ling-Hong; ZHOU He-Ping; HUANG He-Ji; WANG Shao-Hong

State Key Lab of New Ceramic and Fine Processing; Department of Materials Science and Engineering Tsinghua University Beijing 100084; China

Received:2000-11-29 Revised:2001-02-20 Published:2001-11-20 Online:2001-11-20

摘要/Abstract

摘要： 综述了近年来国内外多层片式电感器介质材料及其工艺研究的发展现状和方向，介绍了不同的频率段，应选择不同的低烧材料作为器件的介质材料，特别针对有关用于高频ＭＬＣＩｓ的低介瓷的研究进行了详细的介绍．同时概括了多层片式电感器生产的特殊而典型工艺过程．

关键词: 多层片式电感（MLCIs）, 低烧介质材料, 多层片式工艺

Abstract: Recently overseas and domestic general situation and developing tendence about dielec- tric materials and the processings for MLCIs were reviewed. Different low-temperature sintering materials should be selected for MLCIs in different frequency ranges. The research on the low dielectric constants materials for high frequency MLCIs particularly was introduced. While the specially and typically producing processings of MLCIs were summarized

Key words: multilayer chip inductors, low-temperature sintering dielectric materials, multilayer chip processings

中图分类号:

TM55

罗凌虹,周和平,黄河激,王少洪. 多层片式电感器介质材料及其工艺的发展现状[J]. 无机材料学报.

LUO Ling-Hong,ZHOU He-Ping,HUANG He-Ji,WANG Shao-Hong. Development of Dielectric Materials and Processing for Mulitilayer Chip Inductors[J]. Journal of Inorganic Materials.

参考文献

[1] Sung Hsiao-Miin, Chen Chi-Jen, Wang Lih-Jiun, et al. IEEE Transaction on Magnetics, 1998, 34 (4): 1363--1365.
[2] 周海涛, 张怀武. 磁性材料及器件, 1999, 30 (4): 12--14.
[3] Minoru Takaya. JEE, 1986, December, 38--41.
[4] Minoru Takaya. JEE, 1989, October, 116--118.
[5] Toshimi Kaneko, Hiromichi Tokuda. JEE, 1990, June, 46--48.
[6] 向勇, 谢道华. 电子元件与材料, 1999, 18 (4): 34--40.
[7] Hsu Jen-Yan, Lin Hon-Chin, Shen Hon-Dar, et al. IEEE Transactions on Magnetics, 1997, 33 (5): 3325--3327.
[8] Hsu Jen-Yan, Ko Wen-Song, Shen Hon-Dar, et al. IEEE Transactions on Magnetics, 1994, 30 (6): 4875--4877.
[9] 何新华, 熊茂仁, 凌志远, 等(HE Xin-Hua, et al). 无机材?料学报(Journal of Inorganic Materials), 1999, 14 (1): 71--77.
[10] Shroti J J, Kularni S D, Deshpande C E. Materials Chemistry and Physics, 1999, 59: 1--5.
[11] Masayuki Fujimoto, Yuji Nishi, Toshimasa Suzuki. Coherent, Journal of the American Ceramics Society, 1998, 81 (9): 2477--2480.
[12] Fujimoto Masayuki. Journal of the American Ceramics Society, 1994, 77 (11): 2873--2878.
[13] Fujimoto Masayuki, Hoshi Ken-ichi, Nakazawa Mutsuo. Japanese Journal of Applied Physics, 1993, 32: 5532--5536.
[14] 周济, 吴海燕, 桂治轮, 等. 功能材料, 1997, 28 (1): 22--25.
[15] Jean Jau-Ho, Lee Cheng-Horng. Journal of the American Ceramics Society, 1999, 82 (2): 343--350.
[16] Chatterjee A, Das D, Pradhan S K, et al. Journal of Magnetism and Magnetic Materials, 1993, 127: 214--218. 奬re{[17] Sung Hsiao-Miin, Chen Chi-Jen, Ko Wen-Song, et al. IEEE Transactions on Magnetics, 1994, 30 (6): 4906--4908.
[18] Yue Zhengxing, Li Longtu, Zhou Ji, et al. Materials Science and Engineering, 1999, B64: 68--72.
[19] 廖绍彬, 铁磁学. 凝聚态物理学丛书(下册). 北京: 科学出版社. 16--19.
[20] 岳振星, 周济, 张洪国, 等(YUE Zhen-Xing, et al). 无?机材料学报(Journal of Inorganic Materials), 1999, 14 (3): 375--379.
[21] Pal M, Brahma P, Chakravorty D. Journal of Magnetism and Magnetic Materials, 1996, 164: 256--260.
[22] (英)P.W. 麦克米伦著, 王仞千译, 李家治校. 微晶玻璃. 北京: 中?国建筑工业出版社, 1988. 87--94.
[23] Malcolm D. Glendenning, William E. Lee. J. Am. Ceram. Soc., 1996, 79 (3): ?705--713.
[24] Yang CHeng-Fu. Journal of Materials Science Letters, 1996, 15: 1618--1620.
[25] Rao R, Ummala T. J. Am. Ceram. Soc., 1991, 74 (5): 895--908.
[26] Kazuo Kondo, Masahiko Okuyama, Yoshimasa Shibata. Advances in Ceramics, 19: 77--87.
[27] Kishidak, Sugimotoy, Sunaharah, Talagih, EP 820965-A1; JP 10036167-A.
[28] Jean J. U. S. 5786288-A.
[29] NEC Corp(nide ). JP 06345530-A; JP 96016021-B2.
[30] Kishida K, Nishidem, Sunaharah H, Takahih. JP 11335162-A; EP960866-A1.
[31] Mitsubishi Denki Kk(MITQ), JP 62219994-A.
[32] Asahi Glass Co Ltd(ASAG), JP 01045743-A.
[33] Tamura Seisakusho Kk(TAKX), JP 05155656-A.
[34] Huangr, Yamamoto JK, U. S. 5858893-A.
[35] Takabatake M, Chiba J, Okubu Y K. U. S. Pat. NO. 4593 006, 1986.
[36] Bhedwar H C, Eustice A L, Horowitz S J, et al. Proceedings of the Electrical Material Processes Conference(SAMPE), Santa Clara, CA, June 23-25, 1987. 720--734.
[37] Kamehara N, Kurihara K F D, Niwa K U S. Pat. No. 4 504 339, 1985.
[38] Tosaki H, Sugishita N, Ikegami A. ISHM Proceedings. Chicago, IL, October 12-14, 1981. 100--105.
[39] Kumar A H, McMillan P W, Tummala R. U. S. Pat. No. 4413 061, 1983.
[40] Nishimura T, Nakatani S, Yuhaku S, et al. IMC Proceeding, Kobe, Japan, May 28-30, 1986. 249--254.
[41] Mandai H, Sough K, Tsukamoto K, et al. IMC Proceedings. Kobe Japan, May 28-30, 1986. 61--64.
[42] Nishigaki S, Yano S, Kawabe H, et al. LFC-111: ISHM Proceedings. Minneapolis, MN, Setember, 28-30, 1987. 400--407.
[43] Shimada Y, Yamashita Y, Shiozawa Y, et al. 37th Electrical Components Conference (SAMPE). Santa Clara, CA, June 23-25, 1986.
[44] Kondo K, Okuyama M. U. S. Pat. No. 4 540 671, 1985.
[45] Tosaka S, Hirooka S, Nishimura N, et al. IEEE Components, Hybids, and Manufacturing Technology Proceedings. Tokyo, Japan, October 1-3, 1984. 29--32.
[46] Thanh T D, Iwasw N, Egami H, et al. IMC Proceedings. Tokyo, Japan, Way 21-23, 1984. 220--223.
[47] Dai S X, Huang R F, Wilcox D L. 第一届中国先进陶瓷国际研?讨会会议录，第一版. 北京: 清华大学出版社, 1999. 338--340.
[48] Saehill H T. Advances in Ceramics, 26: 307--319.
[49] Mattox Douglas M, Gurkovich S R, Olenick J A, et al. Advances in Ceramics, ?补年份, 26: 431--443.
[50] 关振铎, 张中太, 焦金生编著. 无机材料物理性能. 北京: 清华大?学出版社, 287--334.
[51] Luo L H, Zhuo H P, Zha Zh, et al. Low Firing Temperature Ceramic Materials for High Frequency Multiplayer Chip Inductors. (received by Journal of the Material Science).
[52] Luo L H, Zhuo H P, Zha, Zh, et al. Low-tan $\delta$ and Low-T Sintering Materials for High Frequency Multiplayer Chip Inductors.(unpublish)
[53] Yamashita Y. Ceramics, 1992, 27 (7): 640.