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无机材料学报

无机材料学报

• 研究论文 • 上一篇    下一篇

直接敷铜Al2O3陶瓷基板的界面产物研究

方志远; 陈虎; 周和平   

  1. 清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室, 北京 100084
  • 收稿日期:1999-07-22 修回日期:1999-09-20 出版日期:2000-10-20 网络出版日期:2000-10-20

Interfacial Product of Direct Copper-Bonded Alumina Substrate

FANG Zhi-Yuan; CHEN Hu; ZHOU He-Ping   

  1. State Key Laboratory of New Ceramics and Fine Processing; Department of Materials Science and Engineering; Tsinghua University; BeiJing 100084; China
  • Received:1999-07-22 Revised:1999-09-20 Published:2000-10-20 Online:2000-10-20

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1074

摘要： 直接敷铜Ａｌ２Ｏ３基板已被广泛应用于大功率场合．本文通过Ｃｕ箔表面预氧化生成Ｃｕ２Ｏ的方法引入氧，１０７０℃在Ｃｕ箱和Ａｌ２Ｏ３基板界面上所产生的Ｃｕ－Ｃｕ２Ｏ共晶液体促进了二者的牢固结合．流动氮气氛下保温１ｈ，观察到了明显的界面产物层．ＳＥＭ和ＸＲＤ的分析表明，界面产物相为ＣｕＡｌＯ２．

关键词: 直接敷铜法, 预氧化, 界面产物

Abstract: Direct copper-bonded alumina substrates were widely used in large-power applications. Cu-Cu2O eutectic bonding of copper to Al2O3 was investigated in this paper. Oxygen was introduced by pre-oxidizing copper foil and it was shown that Cu-Cu2O eutectic liquid promoted the bonding between copper and Al2O3 greatly. Chemical reaction happened at the solid-liquid interface and led to the formation of the binary oxide CuAlO2, which can be observed when the specimen was prepared at 1070℃ for 60min.

Key words: direct bonded copper（DBC）, pre-oxidizing, interfacial product

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