AlN表面处理及级配填充对覆铜板绝缘层性能的影响规律与机制研究
张维维, 陆晨, 应国兵, 张建峰, 江莞
Effect and Mechanism of the Surface Treatment and Gradation Filling of AlN on the Performance of Insulation Layer of Copper Clad Laminate
ZHANG Weiwei, LU Chen, YING Guobing, ZHANG Jianfeng, JIANG Wan
无机材料学报
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2021, (8): 847
-855
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DOI: 10.15541/jim20200639
