实现了二维C/SiC与Nb合金NbHf10-1M的可靠连接. 连接时将Ti-Cu核心中间层与Cu辅助中间层构成的叠层结构置于C/SiC与Nb合金之间, 并采用了固相扩散连接与瞬间液相扩散连接(Transient liquid phase-diffusion bonding, TLP-DB)相结合的连接方法. 结果表明: 辅助中间层厚度>0.72mm时, 可以有效缓解接头热应力. 核心中间层在TLP-DB过程中形成的液相对C/SiC具有良好浸润性, 可渗入C/SiC基体, 并包裹位于核心中间层与C/SiC界面区域的C纤维. 接头剪切强度最高为14.1MPa.
2D C/SiC and niobium alloy NbHf10-1M were successfully joined. The joining material, posited between 2D C/SiC and NbHf10-1M, was a lamination formed by a main interlayer of Ti-Cu and an assistant interlayer of Cu. The joining process consisted of solid diffusion bonding and transient liquid phase diffusion bonding (TLP-DB). The study shows that the increase of the thickness of assistant interlayer Cu can decrease the thermal stress in joint. The Ti-Cu liquid alloy formed in TLP-DB process, has good wettability with C/SiC and easily infiltrates into C/SiC and wrapes the C fibers on the joining surface.
The highest shear stress of joint is 14.1 MPa.
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