印章结构对微接触印刷制备导电网格的影响

doi:10.15541/jim20160579

无机材料学报 ›› 2017, Vol. 32 ›› Issue (7): 713-718.DOI: 10.15541/jim20160579

印章结构对微接触印刷制备导电网格的影响

辛智青, 李修, 姬磊, 李泽涛, 项飞翔, 刘世丽, 李路海

(北京印刷学院印刷与包装工程学院, 北京市印刷电子工程技术研究中心, 北京102600)

收稿日期:2016-10-19 修回日期:2016-12-03 出版日期:2017-07-20 网络出版日期:2017-06-23
作者简介:辛智青(1980–), 男, 博士, 讲师. E-mail: zhiqingxin@bigc.edu.cn
基金资助:
国家自然科学基金(21403014,61474144);北京印刷学院校级一般科研项目(Eb201501);绿色印刷与出版技术协同创新中心(2011);北京高等学校高水平人才交叉培养实培计划;北京印刷学院重点项目(Ea201501)

Stamp Structure on the Conductive Grid Patterns Prepared by Microcontact Printing

XIN Zhi-Qing, LI Xiu, JI Lei, LI Ze-Tao, XIANG Fei-Xiang, LIU Shi-Li, LI Lu-Hai

(School of Printing & Packaging, Beijing Institute of Graphic Communication, Beijing Printed Electronics Engineering Technology Research Center, Beijing 102600, China)

Received:2016-10-19 Revised:2016-12-03 Published:2017-07-20 Online:2017-06-23
About author:XIN Zhi-Qing. E-mail: zhiqingxin@bigc.edu.cn
Supported by:
National Natural Science Foundation of China (21403014, 61474144);General Project of Beijing Institute of Graphic Communication (Eb201501);Collaborative Innovation Center of Green Printing & Publishing Technology (2011);Gross Training Plan of High Level Talents in Beijing Colleges and Universities;Key Project of Beijing Institute of Graphic Commication (Ea201501)

摘要/Abstract

摘要：

为了在PET基底上制备精细的透明网格状导电图案, 本工作利用微接触印刷高精度的优势, 分别采用线条结构和网格结构的印章转印银纳米粒子导电油墨, 分析了其转印过程, 并讨论了印章结构对网格图案性能的影响。结果表明: 采用线条结构的印章可真实还原印章设计尺寸, 避免了线条的扩展, 有利于提高网格图案的透光率; 同时, 在交叉处墨层较厚可提高导电性。而采用网格结构印章可一次转移快速获得网格图案, 但由于印章网格上相邻线条之间液桥的形成会使图案线宽增加, 降低其透光率; 采用间距较大的印章可使液桥断裂, 得到边缘光滑的网格图案, 但间距增大导致单位面积导电路径减少, 降低其导电性。总之, 采用线条结构印章有利于获得性能较好的网格图案, 但两次转移过程相对复杂, 需用时间较长。

关键词: 微接触印刷, 网格图案, 导电油墨, 银纳米粒子

Abstract:

Conductive grid patterns with fine line were achieved on the PET substrate via microcontact printing silver nanoparticle ink for its high resolution advantage. Conductive grids were patterned and compared by using the stamps with either line- or grid-structured patterns. When using line-structured stamp, the line width of the grid pattern was nearly the same as that on the stamp and the printed line edge was also smooth. The extra thickness at the cross of the grid which was due to two sequential stamp operations, was beneficial for higher conductivity. When using the grid-structured stamp, the conductive grid was acquired by only one stamp operation. However, the line width was broader than designed on the stamp and the line edge was poorer amid to liquid bridges formed between two adjacent lines on the stamp. The situation improved for the liquid bridge was easy to rupture when the line spacing of the grid line became bigger, but the conductivity was lowered as fewer conductive paths within the unit area. Hence, it is beneficial to acquire grid patterns using line-structured stamp, but the process is complicated and it will take longer time to complete two successive transfer processes.

Key words: microcontact printing, grid patterns, conductive ink, silver nanoparticles

中图分类号:

O647

辛智青, 李修, 姬磊, 李泽涛, 项飞翔, 刘世丽, 李路海. 印章结构对微接触印刷制备导电网格的影响[J]. 无机材料学报, 2017, 32(7): 713-718.

XIN Zhi-Qing, LI Xiu, JI Lei, LI Ze-Tao, XIANG Fei-Xiang, LIU Shi-Li, LI Lu-Hai. Stamp Structure on the Conductive Grid Patterns Prepared by Microcontact Printing[J]. Journal of Inorganic Materials, 2017, 32(7): 713-718.

图/表 8

图1 (a)用于转印的线条结构和网格结构印章图片(间距10 μm、宽10 μm)和(b)微接触印刷导电油墨过程

Fig. 1 (a) Optical image of the used PDMS stamp (10 μm width and 10 μm space) and (b) μCP process of conductive ink

表1 O2等离子体处理不同时间的PDMS印章的接触角和表面能

Table 1 Contact angle and surface energy of PDMS after O2 plasma treatment for different time

t/s	θ₁/(°)	θ₂/(°)	W/(mJ•m^-2)
0	113.8	92.6	46.1
5	68.7	54.5	155.9
10	53.8	53.7	190.0
15	36.5	53.3	236.4
20	34.8	53.0	241.7

图2 等离子体处理印章不同时间后转印的线条图案

Fig. 2 Line patterns at different treating time of stamp via O2 plasma(a) 5 s; (b) 10 s; (c) 15 s

图3 采用不同间距的印章两次交叉转印的网格图案

Fig. 3 Grid patterns using PDMS stamp with different spaces when two times transfering(a) 10 μm; (b) 20 μm; (c) 40 μm

图4 网格空隙处形成的墨膜破裂形成液桥过程

Fig. 4 Rupture process of thin ink film over the depressed hole of the stamp and formation of liquid bridge

图5 采用不同间距的网格印章转印的图案

Fig. 5 Morphologies of transferred patterns using grid-structured stamp with different size holes(a) 10 μm; (b) 20 μm; (c) 40 μm

图6 两种结构的印章转印的网格图案的透光率对比

Fig. 6 Transmittance comparison of grid patterns prepared with line- and grid-structured stamp

图7 两种结构的印章转印的网格图案的导电性对比

Fig. 7 Conductivity comparison of grid patterns prepared with line- and grid-structured stamp

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印章结构对微接触印刷制备导电网格的影响

Stamp Structure on the Conductive Grid Patterns Prepared by Microcontact Printing

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