Al/Al2O3陶瓷接合基板的制备及性能研究

无机材料学报

Al/Al₂O₃陶瓷接合基板的制备及性能研究

彭榕; 周和平; 宁晓山; 徐伟; 林渊博

清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室，北京 100084

收稿日期:2001-07-04 修回日期:2001-09-03 出版日期:2002-07-20 网络出版日期:2002-07-20

Research of the Performance of A1/Al₂O₃ Substrate

PENG Rong; ZHOU He-Ping; NING Xiao-Shan; XU Wei; LIN Yuan-Bo

The State Key Laboratory of New Ceramic and Fine Processing; Department of Materials Science and Engineering; Tsinghua University; Beijing 100084; China

Received:2001-07-04 Revised:2001-09-03 Published:2002-07-20 Online:2002-07-20

摘要/Abstract

摘要： 在675～825℃、氮气气氛下,使用石墨模具压铸的方法制备出Al/A1₂O₃电子陶瓷基板,利用力学拉伸试验机测试了Al和Al₂O₃的结合强度,界面抗拉强度>15.94MPa,使用金相显微镜、SEM等微观分析仪器研究了其界面的微观结构.

关键词: 敷接, 剥离强度, Al/Al₂O₃电子陶瓷基板

Abstract: After getting rid of Al₂O₃ film from the surface of melting Al, Al can wet and bond Al₂O₃ substrate perfectly. In this work, by die-casting-bonding process, in the temperautre range of 948-1098K and under N₂ atmosphere, Al/Al₂O₃ substrates were produced successfully. The performance of Al/Al₂O₃ substrates was investigated by SEM and mechanic testing equipment. The bonding strength of Al/Al₂O₃ measured is more than 15.94MPa.

Key words: bonding, Al, die-casting-bonding Al₂O₃ substrates

中图分类号:

TQ174

彭榕,周和平,宁晓山,徐伟,林渊博. Al/Al₂O₃陶瓷接合基板的制备及性能研究[J]. 无机材料学报.

PENG Rong,ZHOU He-Ping,NING Xiao-Shan,XU Wei,LIN Yuan-Bo. Research of the Performance of A1/Al₂O₃ Substrate[J]. Journal of Inorganic Materials.

[1]	许昕睿,庄汉锐,李文兰,徐素英,张宝林,江国健. AlN陶瓷基板覆铜技术的研究[J]. 无机材料学报, 2003, 18(4): 837-842.
[2]	彭榕,周和平,宁晓山,林渊博,徐伟. 铝/氮化铝电子陶瓷基板的制备及性能的研究[J]. 无机材料学报, 2002, 17(6): 1203-1208.
[3]	方志远,周和平,陈虎. Al₂O₃基板直接敷铜法的敷接机理研究[J]. 无机材料学报, 2000, 15(4): 641-646.

Al/Al₂O₃陶瓷接合基板的制备及性能研究

Research of the Performance of A1/Al₂O₃ Substrate

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