第三代半导体互连材料与低温烧结纳米铜材的研究进展
Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles
(a) TEM image showing micron particles; (b) TEM image showing nanoparticles
第三代半导体互连材料与低温烧结纳米铜材的研究进展 |
| 柯鑫, 谢炳卿, 王忠, 张敬国, 王建伟, 李占荣, 贺会军, 汪礼敏 |
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Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles |
| KE Xin, XIE Bingqing, WANG Zhong, ZHANG Jingguo, WANG Jianwei, LI Zhanrong, HE Huijun, WANG Limin |
| 图8 不同粒径混合的微纳米铜颗粒结构[ |
| Fig. 8 Structures of micro-nano copper particles mixed with different particle sizes[ (a) TEM image showing micron particles; (b) TEM image showing nanoparticles |
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