第三代半导体互连材料与低温烧结纳米铜材的研究进展

柯鑫, 谢炳卿, 王忠, 张敬国, 王建伟, 李占荣, 贺会军, 汪礼敏

Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles

KE Xin, XIE Bingqing, WANG Zhong, ZHANG Jingguo, WANG Jianwei, LI Zhanrong, HE Huijun, WANG Limin

图4 不同封装互连材料的使用温度范围和应用可能性[22]

Fig. 4 Applied temperature range and application possibilities of different package interconnect materials[22]