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柯鑫, 谢炳卿, 王忠, 张敬国, 王建伟, 李占荣, 贺会军, 汪礼敏

Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles

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图3 典型功率半导体模块封装互连结构[14]

Fig. 3 Package interconnection structure of typical power semiconductor module[14]