第三代半导体互连材料与低温烧结纳米铜材的研究进展
Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles
第三代半导体互连材料与低温烧结纳米铜材的研究进展 |
| 柯鑫, 谢炳卿, 王忠, 张敬国, 王建伟, 李占荣, 贺会军, 汪礼敏 |
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Progress of Interconnect Materials in the Third-generation Semiconductor and Their Low-temperature Sintering of Copper Nanoparticles |
| KE Xin, XIE Bingqing, WANG Zhong, ZHANG Jingguo, WANG Jianwei, LI Zhanrong, HE Huijun, WANG Limin |
| 图11 抗坏血酸(AA)在铜浆中的促进作用机理[ |
| Fig. 11 Mechanism of promotion in copper slurry by ascorbic acid (AA)[ |
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