Nb/Mg3SbBi界面层热稳定性研究
胡忠良1(
), 傅赟天1, 蒋蒙1, 王连军1, 江莞1,2()
), 傅赟天1, 蒋蒙1, 王连军1, 江莞1,2()
Thermal Stability of Nb/Mg3SbBi Interface
HU Zhongliang1(), FU Yuntian1, JIANG Meng1, WANG Lianjun1, JIANG Wan1,2()
), FU Yuntian1, JIANG Meng1, WANG Lianjun1, JIANG Wan1,2()
图3. 热压750 ℃热压烧结不同时间的样品的热电性能随测试温度的变化曲线
Fig. 3. Thermoelectric properties of hot-pressed 750 ℃ sintered samples with various holding time as a function of test temperature
(a) Electrical conductivity; (b) Seebeck coefficient; (c) Lattice thermal conductivity; (d) ZT
