功率模块封装用高强度高热导率Si3N4陶瓷的研究进展
付师1,2(
), 杨增朝1(), 李江涛1,2()
), 杨增朝1(), 李江涛1,2()
Progress of High Strength and High Thermal Conductivity Si3N4 Ceramics for Power Module Packaging
FU Shi1,2(), YANG Zengchao1(), LI Jiangtao1,2()
), YANG Zengchao1(), LI Jiangtao1,2()
图9. Si3N4 陶瓷的(a)平均晶粒尺寸、(b)弯曲强度、(c)断裂韧性和(d)热导率随稀土离子半径的变化[
Fig. 9. Change of (a) average grain size, (b) bending strength, (c) fracture toughness, and (d) thermal conductivity of Si3N4 ceramics with radius of rare earth ion[
REM: Before annealing; REMH: After annealing
