功率模块封装用高强度高热导率Si3N4陶瓷的研究进展
付师1,2(
), 杨增朝1(), 李江涛1,2()
), 杨增朝1(), 李江涛1,2()
Progress of High Strength and High Thermal Conductivity Si3N4 Ceramics for Power Module Packaging
FU Shi1,2(), YANG Zengchao1(), LI Jiangtao1,2()
), YANG Zengchao1(), LI Jiangtao1,2()
图8. 不同烧结助剂体系和烧结方法制备高热导率Si3N4陶瓷的研究进展
Fig. 8. Developments of high thermal conductivity Si3N4 ceramics with different sintering additives systems and sintering methods
GPS: Gas pressure sintering, HIP: Hot isostatic pressing, HP: Hot pressed, SRBSN: Sintering of reaction-bonded Si3N4, M-SRBSN: Modified sintering of reaction-bonded Si3N4, SPS: Spark plasma sintering, PLS: pressless sintering, PSRBSN: Pressure-sintered reaction-bonded Si3N4. Numbers in the chart represent relevant references
