功率模块封装用高强度高热导率Si3N4陶瓷的研究进展
付师1,2(
), 杨增朝1(), 李江涛1,2()
), 杨增朝1(), 李江涛1,2()
Progress of High Strength and High Thermal Conductivity Si3N4 Ceramics for Power Module Packaging
FU Shi1,2(), YANG Zengchao1(), LI Jiangtao1,2()
), YANG Zengchao1(), LI Jiangtao1,2()
图7. Si3N4样品的明场TEM照片[
Fig. 7. Bright-field (BF) TEM images of Si3N4 samples[
(a) Containing lattice defects (indicated by black arrows); (b) No lattice defects included
