功率模块封装用高强度高热导率Si3N4陶瓷的研究进展
付师1,2(
), 杨增朝1(), 李江涛1,2()
), 杨增朝1(), 李江涛1,2()
Progress of High Strength and High Thermal Conductivity Si3N4 Ceramics for Power Module Packaging
FU Shi1,2(), YANG Zengchao1(), LI Jiangtao1,2()
), YANG Zengchao1(), LI Jiangtao1,2()
图4. 晶粒尺寸对不同晶界膜厚度β-Si3N4热导率的影响规律[
Fig. 4. Effect of grain size on the thermal conductivity of β-Si3N4 with various grain-boundary film thicknesses[
Grain-boundary film thickness δ=1, 10 and 50 nm. Calculations were performed using the aspect ratio at 5 and the volume fraction of grain boundary phase at 6%. ‘Para’ and ‘perp’ indicate thermal conductivity parallel and perpendicular to the hot-press direction, respectively
