功率模块封装用高强度高热导率Si3N4陶瓷的研究进展
付师1,2(
), 杨增朝1(), 李江涛1,2()
), 杨增朝1(), 李江涛1,2()
Progress of High Strength and High Thermal Conductivity Si3N4 Ceramics for Power Module Packaging
FU Shi1,2(), YANG Zengchao1(), LI Jiangtao1,2()
), YANG Zengchao1(), LI Jiangtao1,2()
图12. 添加碳对Si3N4陶瓷微结构的影响[
Fig. 12. Effect of carbon addition on the microstructure of Si3N4 ceramics[
(a, b) Low-magnification images of (a) SN and (b) SNC; (c, d) High- magnification images of (c) SN and (d) SNC. SN: Carbon free; SNC: Containing carbon
