功率模块封装用高强度高热导率Si3N4陶瓷的研究进展
付师1,2(
), 杨增朝1(), 李江涛1,2()
), 杨增朝1(), 李江涛1,2()
Progress of High Strength and High Thermal Conductivity Si3N4 Ceramics for Power Module Packaging
FU Shi1,2(), YANG Zengchao1(), LI Jiangtao1,2()
), YANG Zengchao1(), LI Jiangtao1,2()
图11. 烧结助剂ZrH2在Si3N4陶瓷烧结中的作用机理示意图[
Fig. 11. Schematic diagram of the mechanism of sintering additive ZrH2 in the sintering of Si3N4 ceramics[
