基于固体聚硅氧烷的前驱体浸渍裂解法(PIP)制备C/SiOC复合材料及其微结构与力学性能研究
吴青青1,2,王震1,3(
),丁奇1,2,4,倪德伟1,3,阚艳梅1,3,董绍明1,5()
),丁奇1,2,4,倪德伟1,3,阚艳梅1,3,董绍明1,5()
C/SiOC Composites by a Modified PIP Using Solid Polysiloxane: Fabrication, Microstructure and Mechanical Properties
WU Qing-Qing1,2,WANG Zhen1,3(),DING Qi1,2,4,NI De-Wei1,3,KAN Yan-Mei1,3,DONG Shao-Ming1,5()
),DING Qi1,2,4,NI De-Wei1,3,KAN Yan-Mei1,3,DONG Shao-Ming1,5()
Fig. 6. (a) Cross-linking reactions during the curing process; (b) FT-IR spectra of as-obtained MK resin without curing and MK resin with 0.01wt% CLA after curing at 160 ℃ for different time; (c) details in enlarged view of wavenumber in the range from 1250 cm-1 to 500 cm-1
.
