基于固体聚硅氧烷的前驱体浸渍裂解法(PIP)制备C/SiOC复合材料及其微结构与力学性能研究 |
吴青青,王震,丁奇,倪德伟,阚艳梅,董绍明 |
C/SiOC Composites by a Modified PIP Using Solid Polysiloxane: Fabrication, Microstructure and Mechanical Properties |
WU Qing-Qing,WANG Zhen,DING Qi,NI De-Wei,KAN Yan-Mei,DONG Shao-Ming |
Fig. 6 (a) Cross-linking reactions during the curing process; (b) FT-IR spectra of as-obtained MK resin without curing and MK resin with 0.01wt% CLA after curing at 160 ℃ for different time; (c) details in enlarged view of wavenumber in the range from 1250 cm-1 to 500 cm-1 |
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